Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls for GPU CPU IC Chip PCB(9 Bottles 0.3mm-0.76mm)

Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls for GPU CPU IC Chip PCB(9 Bottles 0.3mm-0.76mm)

    Features:

  • This tin solder ball 100% brand new and high quality, durable material for a long time use.
  • These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
  • They are quite small and can transmit electronic signal, very useful for your soldering work.
  • Each bottle contains about 25000 solder balls that will meet your basic soldering need.
  • There are many different sizes you can choose, and you can choose 9 bottles to get them all.

Actopus 5 Bottle BGA Lead Solder Balls Tin Ball For Soldering Rework

Actopus 5 Bottle BGA Lead Solder Balls Tin Ball For Soldering Rework

    Features:

  • 5 Bottle Bga Lead Solder Balls 25000pcs/bottle Tin Ball For Soldering Rework
  • Size : 0.4mm 0.45mm 0.5mm 0.6mm 0.76mm With about 25000 pcs solder balls in one bottle- the smaller ball- the smaller volume would be.
  • Very useful for your soldering work.

LNIMI Bga Reballing Kit 90Mm Aluminium Alloy Mesh Bga Reballing Station With Hand Shank Bga Universal Stencil + 10Pc Bga Solder Ball

LNIMI Bga Reballing Kit 90Mm Aluminium Alloy Mesh Bga Reballing Station With Hand Shank Bga Universal Stencil + 10Pc Bga Solder Ball

    Features:

  • Slider slide freely plant outside diameter 5MM – 50MM chip and meet the desktop PC, laptop, BGA chip and mobile phone, BOX machine chip!
  • Add adjustable plane screw in the middle, easier to operate, with a scale, diameter 90 * 90MM, convenient and intuitive, making exquisite beauty!
  • Quality sik Chu Taiwan, all aluminum plating, not easily oxidized. The use of more durable, resistant to wear!
  • With adjustment a hex wrench, and easy to use!
  • Professional and efficient, maintenance personnel must!

Beennex Lead-tin BGA Solder Reballing Balls Soldering Rework Repair Tools (0.25mm)

Beennex Lead-tin BGA Solder Reballing Balls Soldering Rework Repair Tools (0.25mm)

    Features:

  • Eco-friendly lead-tin balls, bright and full solder joint, little smoke, no irritating smell.
  • Strong welding force, widely used in all kinds of electronic products.
  • Easy to weld, no false welding. 25000pcs/bottle for enough use.
  • Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm
  • Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.

Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls for GPU CPU IC Chip PCB(0.3mm)

Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls for GPU CPU IC Chip PCB(0.3mm)

    Features:

  • This tin solder ball 100% brand new and high quality, durable material for a long time use.
  • These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
  • They are quite small and can transmit electronic signal, very useful for your soldering work.
  • Each bottle contains about 25000 solder balls that will meet your basic soldering need.
  • There are many different sizes you can choose, and you can choose 9 bottles to get them all.

Beennex Lead-tin BGA Solder Reballing Balls Soldering Rework Repair Tools (0.65mm)

Beennex Lead-tin BGA Solder Reballing Balls Soldering Rework Repair Tools (0.65mm)

    Features:

  • Eco-friendly lead-tin balls, bright and full solder joint, little smoke, no irritating smell.
  • Strong welding force, widely used in all kinds of electronic products.
  • Easy to weld, no false welding. 25000pcs/bottle for enough use.
  • Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm
  • Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.

BGA, Tin Solder Ball, Lead-Free Reballing, Soldering Heat Universal Stencil Balls(0.4mm)

BGA, Tin Solder Ball, Lead-Free Reballing, Soldering Heat Universal Stencil Balls(0.4mm)

    Features:

  • DURABLE MATERIAL– This Lead-free tin solder ball 100% brand new and high quality, durable material for a long time use.
  • APPLICATION– These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
  • USEFUL FOR YOUR SOLDERING WORK– They are quite small and can transmit electronic signal, very useful for your soldering work.
  • MEET YOUR BASIC NEED– Each bottle contains about 25000 solder balls that will meet your basic need.
  • MANY DIFFERENT SIZES– There are many different sizes you can choose, and you can choose 9 bottles to get them all.

Baosity CXD9963GB BGA Chip IC Chipset with Solder Balls – Games Console Replace Part

Baosity CXD9963GB BGA Chip IC Chipset with Solder Balls - Games Console Replace Part

    Features:

  • Material: Plastic
  • Size: 23*23mm
  • Size: 23*23mm
  • Professional skills are needed.
  • No need to pay for the high repair fee.

Leaded Solder Balls BGA Reballing 0.55mm 250 Thousand Grains Tin Balls Welding Accessories for Laptop Phone Repair

Leaded Solder Balls BGA Reballing 0.55mm 250 Thousand Grains Tin Balls Welding Accessories for Laptop Phone Repair

    Features:

  • ¡¾IMPROVE THE OXIDATION ABILITY¡¿-Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit
  • ¡¾WIDELY USED¡¿-Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic signals with ultra?small ball tin electronic parts, etc.
  • ¡¾MORE DURABLE¡¿-The solder with leaded tin balls is more durable and can help you solder effectively
  • ¡¾A LARGE NUMBER¡¿-A large number, can meet your use and replacement needs, very practically
  • ¡¾SMALL SIZE¡¿-Use bottled pack and small size, easy to carry and store, convenient to use and with good performance

Beennex Lead-tin BGA Solder Reballing Balls Soldering Rework Repair Tools (0.45mm)

Beennex Lead-tin BGA Solder Reballing Balls Soldering Rework Repair Tools (0.45mm)

    Features:

  • Eco-friendly lead-tin balls, bright and full solder joint, little smoke, no irritating smell.
  • Strong welding force, widely used in all kinds of electronic products.
  • Easy to weld, no false welding. 25000pcs/bottle for enough use.
  • Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm
  • Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.

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